The incoming inspection of Laser Pointer is very important

The incoming inspection of Laser Pointer is very important.
Trigger circuit, if you meet the standard 5.7.31 of the voltage test, not bound clearance creepage distance or short circuit. The electrode and the filament tube; tube between the cathode filament and insulation; semiconductor devices; addition bayonet lamp ("flower color" light), the lamp lights or warning lights. Disconnect the above components will produce dangerous situations must also reproduced in the test case. Varnishes, enamels or textile insulation short-circuit. This circuit can not be used in the winding insulation and insulating sleeve or similar insulating tube. Insulated parts of the circuit. It may include contact and does not meet the temperature requirements for the prevention of the site, in line with the requirements of section 4.1.6 of this standard except.
Laser marking technology. Laser marking is a non-contact and wear-free non-polluting technology in recent years, new markers, with the laser to improve the reliability and availability, coupled with the rapid development of computer technology and improved optics, laser marking technology to promote The development of laser marking is the use of high energy density laser beam on the target function, the target surface physical or chemical change, resulting in visible pattern of marking high-energy laser beam is focused on the material surface, the rapid vaporization of the material, the formation of pits in the surface with a laser beam moving at the same time regularly breaking the control laser, the laser beam in the material surface processing will become a designated pattern. The design of Laser Pointer needs to be innovative further.
Laser marking process compared with traditional markers has obvious advantages: (a) mark fast, clear writing, permanent; (b) non-contact processing, pollution, no wear and tear; (c) easy to operate, strong security features; (d) can be automated to run high-speed, low production costs. In wafer processing, production of a specific location in the laser chip code, which can effectively enhance the traceability of the chip, and also to provide a certain amount of production management to facilitate the present, making the laser code on the chip is to be a potential industry standard, widely used in silicon germanium material. Machine Tool and slide in a straight line measurement before the advent of the laser collimator, collimation technique is mainly used to pull wire method or the use of optical alignment telescope, but they are there are some shortcomings.